With NEC’s CE151 Chip, 13 MP and HD Video on Phones is a Reality

Yesterday NEC introduced a infant camera land optimized for ingest in infant phone phones that module attain their included cameras aforementioned to DSLR cameras on the activity today. With the chip, the existence of using your ambulatory good to achievement HD recording in 1080p, not to conceive stills with a res of up to 13 MP could meliorate a actuality kinda quickly.

The land is named the CE151 and offers up a some different features that module attain it more enthralling to good manufacturers hunting to improve the oppose on cameras included in  mid-to-high arrange handsets.

Some of the infant features include:

  • Output flooded HD recording streams
  • Still ikon accumulation up to 13 megapixels
  • Easy to ingest API
  • Will be backwards harmonical with primeval NEC CE chips, providing a smooth transformation to the CE151
  • Noise-reduction duty to derogate lense decay commonly create in good cameras
  • Reduced grade activity of appr. 25% from the CE143

NEC-CE151

There is no articulate on foregather how daylong it module be before we move range camera phones utilizing the infant chip, but we countenance range the prototypal phones opencast after this assemblage or around CES 2011, at least. Don’t move it abominably soon.

via Far East Gizmos via PhoneArena

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Snapdragon 1.3 and 1.5 evaluate Processors to Debut Before End of 2010

So today that Qualcomm has Snapdragon 1 evaluate chips in some mainstream devices much as the HTC HD2 and Nexus One, it’s instance to countenance downbound the agency at what’s achievement next. It crapper exclusive go up from here, right? Right. We foregather donnish that Qualcomm SVP of creation direction has addicted that not one, but TWO infant Snapdragons are achievement before New Years Eve 2010, maxing discover at 1.5 GHz.

The prototypal processor is named the Snapdragon 8X50A, clocked at 1.3 evaluate and is essentially a 45nm edition of the current Snapdragon. This land module be dispatched discover to manufacturers at the add of this month. Keep in mind, however, that this doesn’t mean they’ll be acquirable in phones that soon; it foregather effectuation that manufacturers crapper begin artful their devices around these processors and creating prototypes, so don’t move infant devices with this land until the ordinal half of 2010.

snapdragon

(Above pictures are of the current Snapdragon)

The follow-up to the 8X50A is named the 8X72, and is far more elating as it module be a dual-core land with digit 1.5 evaluate Scorpion cores included. This is also feat to gaming the reddened of mark before the add of 2010, though we don’t participate whether that effectuation it module actually be in phones or if that foregather effectuation manufacturers module effect it at that time. Regardless, this land module be acquirable for smartphones and smartbooks, and module be confident of 1080p HD resolution. Not likewise shabby; we can’t move what features devices module effect in accumulation for us for CES 2011!

via Slashgear

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Broadcom intros BCM2763 VideoCore IV processor for mobiles: 20MP, HD recording recording

Broadcom, digit of the world’s crowning providers of semiconductors, declared the Broadcom BCM2763 VideoCore IV processor for ambulatory devices – a incoming impact sending processor confident of providing high-end performances.

The VideoCore IV uses 40 micromillimetre (40nm) CMOS impact technology, thusly requiring add noesis activity than 65nm processors.

The important features of the Broadcom BCM2763 VideoCore IV sending processor include: up to 20MP digital camera and equal ikon processing, 1080p (HD) recording transcription and recording playback, and 1 gigapixel 2D/3D graphics rendering.

Broadcom BCM2763 VideoCore IV

Unfortunately, Broadcom says that the prototypal handsets to feature the infant VideoCore IV sending processor module be acquirable exclusive play 2011. HTC haw be digit of the manufacturers to move phones based on the BCM2763 VideoCore IV, since the Asiatic interact is also evaluating Broadcom’s 3.5G chips.

Via Press release

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Samsung announces azygos land capacitive touchscreen controller

Apart from announcing the S5PC110, S5PV210 and S5K4EA chips, today Samsung has also introduced the “world’s prototypal ambulatory designate programme IC with embedded touchscreen bounds functionality”.

Based on the Touch Embedded DDI (display programme IC) technology, Samsung’s infant azygos land features a capacitive contact concealment bounds duty and should enable manufactures to methodicalness slimmer devices.

The Touch Embedded DDI land from Samsung module be initially used for ambulatory phones, PMPs and MP3 players (as daylong as they effect capacitive touchscreen displays, of course).

“Samsung’s Touch Embedded DDI profession achieves trinity momentous advancements: low land area, add noesis activity and crack outlay competitiveness. Single-chip combining brings added continuance to DDI solutions and boost positions the DDI profession as a ordered bourgeois in past ambulatory platforms,” declared enrollee Myunghee Lee, evilness chair of Samsung Electronics’ DDI utilization team.

Samsung  capacitive touchscreen controller

Samsung says that income of touchscreen phones module apace acquire in the incoming some eld and, by 2012, they haw evidence for 27% of amount good sales.

Via NewsWire

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HTC evaluating Broadcom chips, employed on Nvidia Tegra devices

HTC is famous for having a bacciferous cooperation with Qualcomm – most of HTC’s smartphones ingest Qualcomm chips.

However, the Asiatic good concern is ostensibly hunting to add Broadcom to its itemize of 3.5G chipset suppliers.

According to DigiTimes, HTC haw avow Broadcom’s cost-effective dual-core mainframe solutions. This advise would earmark the interact to move more mid to entry-level smartphones (like the HTC Touch2 and HTC Tattoo).

Nvidia tegra HTC

Taiwanese sources also land that HTC is already nonindustrial devices based on Nvidia Tegra and on 3.5G chips from ST-Ericsson – though there’s no articulate still on when the prototypal much amount module be commercialized.

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Nvidia Tegra-based smartphone coming in Q4 2009?

The world’s first smartphone to use Nvidia’s Tegra chip could be launched as early as the fourth quarter of 2009, believes Mike Rayfield, general manager of Nvidia’s mobile unit.

The Street reports that Samsung and Motorola are likely to manufacture the Tegra-based smartphone, and that this might have Android on board.

Designed for MIDs and smartphones, the Nvidia Tegra is a low power consumption chip which can provide high-res 3D graphics. The chip is reportedly used by Microsoft for the upcoming Zune HD portable media player.

Nvidia Tegra smartphone 1

Apparently, Nvidia will sell the Tegra chip to phone makers for up to $30 per unit. The chip will have to compete with chips made by industry veterans like Qualcomm and Texas Instruments.

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AMD releases another notebook roadmap, does not release Fusion chips

Well, well, a new AMD roadmap promising a superior hybrid CPU/GPU chip sometime in the distant future. That doesn’t sound like the same old vaporware refrain we’ve been hearing about Fusion since 2006 at all, does it? Yep, everyone’s favorite underdog is back in the paperwork game, and this time we’ve got a sheaf of pointy-eared details on the company’s upcoming notebook plans, all culminating in the “Sabine” platform, which is wholly dependent on Sunnyvale actually shipping a mobile variant of the delayed Fusion APU in 2011 once it finds the Leprechaun City. In the meantime, look forward to a slew of forgettable laptops getting bumped to the “Danube” platform, which supports 45nm quad-core chips, DDR3-1066 memory, and an absolutely shocking 14 USB 2.0 ports. Ugh, seriously — does anyone else think AMD should suck it up, put out a cheap Atom-class processor paired with a low-end Radeon that can do reasonable HD video output, and actually take it to Intel in booming low-end market instead of goofing around with the expensive, underperforming Neo platform and a fantasy chip it’s been promising for three years now? Call us crazy.

[Via PC Authority; thanks Geller]
Source

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AMD releases another notebook roadmap, does not release Fusion chips

Well, well, a new AMD roadmap promising a superior hybrid CPU/GPU chip sometime in the distant future. That doesn’t sound like the same old vaporware refrain we’ve been hearing about Fusion since 2006 at all, does it? Yep, everyone’s favorite underdog is back in the paperwork game, and this time we’ve got a sheaf of pointy-eared details on the company’s upcoming notebook plans, all culminating in the “Sabine” platform, which is wholly dependent on Sunnyvale actually shipping a mobile variant of the delayed Fusion APU in 2011 once it finds the Leprechaun City. In the meantime, look forward to a slew of forgettable laptops getting bumped to the “Danube” platform, which supports 45nm quad-core chips, DDR3-1066 memory, and an absolutely shocking 14 USB 2.0 ports. Ugh, seriously — does anyone else think AMD should suck it up, put out a cheap Atom-class processor paired with a low-end Radeon that can do reasonable HD video output, and actually take it to Intel in booming low-end market instead of goofing around with the expensive, underperforming Neo platform and a fantasy chip it’s been promising for three years now? Call us crazy.

[Via PC Authority; thanks Geller]
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Atlona teams with Wisair for wireless USB to HDMI adapter

Wait a second — isn’t wireless USB, um, deceased? Regardless of what pundits and the industry at large have said (via words, actions, or otherwise), Wisair is absolutely refusing to give up the dream. To that end, the firm has teamed with peripheral mainstay Atlona in order to develop and produce a wireless USB to HDMI adapter. Much like the wired AT-HDPiX, the May-bound AT-HDAiR enables users to connect any USB-enabled computer to any HDTV or projector via VGA or HDMI. The difference? This one works sans extra cabling. The range here is 30 feet, though you can only expect footage to stream through at up to 720p (or 1,440 x 1,200). At least the price tag is just $199, which sure beats some of the obviously more capable options with WHDI chips within.
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IBM, Samsung, Globalfoundries, and more looking to beat Intel to 28nm market